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Printed Circuit Board & Flexible PCB
Printed Circuit Board     Flexible PCB
 
Printed Circuit Board
인쇄회로기판은 고성능화를 위해 고밀도 , 고다층화가 진행되고 있으며 경박단소화로 시장추세가 변화 되고 있습니다 . 따라서 다층기판은 고기능 범용기기의 모든 부분에 적용되고 있으며 이에 필요한 어떤 다층기판도 당사에서는 대응 가능합니다
1. Double Side
Specifications
Layers

2~8L

Base Material

FR-4, High Tg

Board Thickness

0.6~1.2mm

Line Width

0.10~0.125mm

Line Spacing

0.10~0.125mm

Min. Hole Size

0.25mm

Surface Treatment

Gold Plating, HASL

Application

CD RW, Printer, FAX, Audio, VCR, DVD

2. Package Substrate
Specifications
Layers

2~8L

Base Material

High-Tg,FR-4,RCC,BT-Resin

Board Thickness

3.94~31.50mil : 0.1~0.8mm

Min. Line Width

1.2mil : 30㎛

Min. Line Spacing

1.4mil : 35㎛

Min. Mech. Drill Size

3.94mil : 100㎛

Min. Laser Drill Size

2.36mil : 60㎛

Min. Ball/Bump Pad Pitch

8.86mil : 225㎛

Surface Treatment

Wire Boardable Gold, Immersion Gold, OSP

Application

PCMCIA Card, Telecommunication, LapTop, PCS, Chipsets

3. Telecommunication
Specifications
Layers
4~10L
Base Material
High-Tg,FR-4,Halogen Free,RoHS,RCC,Aramid
Board Thickness
15.75~47.24mil : 0.4~1.2mm
Min. Line Width
2.5mil : 64㎛
Min. Line Spacing
2.5mil : 64㎛
Min. Mech. Drill Size
5.91mil : 150㎛
Min. Laser Drill Size
3.94mil : 100㎛
Surface Treatment
Immersion Gold, OSP, Selective OSP
Application
Cellular Phone, PCS, Hand Held Device, PDA
4. Memory Module
Specifications
Layers
4~12L
Base Material
High-Tg,FR-4,Halogen Free,RoHS
Board Thickness
16~50mil : 0.406~1.27mm
Min. Line Width
3mil : 76 ㎛
Min. Line Spacing
3mil : 76 ㎛
Min. Mech. Drill Size
7.87mil : 200 ㎛
Impedance Control
+/-8% : +/-8%
Surface Treatment
Gold Finger,Immersion Gold, OSP, HASL
Application
Desk Top, Note Book, Workstation
5. TFT LCD
Specifications
Layers
2~8L
Base Material
High-Tg,FR-4,Halogen Free,RoHS,Middle-Tg
Board Thickness
7.87~63mil : 0.2~1.6mm
Min. Line Width
3mil : 76 ㎛
Min. Line Spacing
3mil : 76 ㎛
Min. Mech. Drill Size
7.87mil : 200 ㎛
Displayl Size
~46inch : ~1,168 ㎛
Surface Treatment
Immersion Gold, OSP
Application
PC Monitor, Note Book Monitor, LCD TV, PDP
6. High Layer Board
Specifications
Layers
12~32L
Base Material
High-Tg,FR-4,Halogen Free,RoHS,RO4000,RCC
Board Thickness
63~126mil : 1.6~3.2mm
Min. Line Width
3mil : 76 ㎛
Min. Line Spacing
3mil : 76 ㎛
Min. Mech. Drill Size
7.87mil : 200 ㎛
Min. Laser Drill Size
3.94mil : 100 ㎛
Surface Treatment
Immersion Gold, OSP, HASL
Application
Network Systems, Servers, Routers, Super Computers
 
Flexible PCB(FPCB)
 
1. Sigle Side FPCB
Specifications
Layers
1L
Base Material
FCCL, Coverlay
Board Thickness
0.06~0.08mm
Trace Width
0.05mm
Line Spacing
0.05mm
Application
CD-ROM Pick Up, Camcoder, Connector
2. Double Side FPCB
Specifications
Layers
1~2L
Base Material
FCCL, Coverlay
Board Thickness
0.15~0.20mm
Trace Width
0.06mm
Line Spacing
0.06mm
Min. Mech. Hole Size
0.12mm
Application
Key Pad, Side Key, Ear Jack
3. Multi Layer FPCB
Specifications
Layers
4~8L
Base Material
FCCL,Coverlay,Bonding Sheet
Board Thickness
0.40~0.80mm
Trace Width
0.075mm
Line Spacing
0.075mm
Min. Mech. Hole Size
0.15mm
Application
LCD Module, Mobile Phone, Digital Camera
4. Next Generation Display
Specifications
Layers
1~2L
Base Material
FCCL,Coverlay
Board Thickness
0.05~0.10mm
Trace Width
0.04mm
Line Spacing
0.04mm
Min. Mech. Hole Size
0.12mm
Application
TFT LCD, PDP
5. Rigid Flexible PCB
Specifications
Layers
4~8L
Base Material
FCCL,Coverlay,Low Regin,Prepreg
Board Thickness
0.40~0.80mm
Trace Width
0.075mm
Line Spacing
0.075mm
Min. Mech. Hole Size
0.15mm
Application
Mobile Phone