| Printed Circuit Board & Flexible PCB |
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 Printed Circuit Board |
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| 1. Double Side |
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Specifications
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Layers
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2~8L |
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Base Material
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FR-4, High Tg |
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Board Thickness
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0.6~1.2mm |
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Line Width
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0.10~0.125mm |
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Line Spacing
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0.10~0.125mm |
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Min. Hole Size
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0.25mm |
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Surface Treatment
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Gold Plating, HASL |
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Application
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CD RW, Printer, FAX, Audio, VCR, DVD |
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| 2. Package Substrate |
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Specifications
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Layers |
2~8L |
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Base Material |
High-Tg,FR-4,RCC,BT-Resin |
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Board Thickness |
3.94~31.50mil : 0.1~0.8mm |
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Min. Line Width |
1.2mil : 30㎛ |
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Min. Line Spacing |
1.4mil : 35㎛ |
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Min. Mech. Drill Size |
3.94mil : 100㎛ |
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Min. Laser Drill Size |
2.36mil : 60㎛ |
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Min. Ball/Bump Pad Pitch |
8.86mil : 225㎛ |
Surface Treatment |
Wire Boardable Gold, Immersion Gold, OSP |
Application |
PCMCIA Card, Telecommunication, LapTop, PCS, Chipsets |
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| 3. Telecommunication |
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Specifications
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Layers |
4~10L |
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Base Material |
High-Tg,FR-4,Halogen Free,RoHS,RCC,Aramid |
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Board Thickness |
15.75~47.24mil : 0.4~1.2mm |
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Min. Line Width |
2.5mil : 64㎛ |
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Min. Line Spacing |
2.5mil : 64㎛ |
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Min. Mech. Drill Size |
5.91mil : 150㎛ |
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Min. Laser Drill Size |
3.94mil : 100㎛ |
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Surface Treatment |
Immersion Gold, OSP, Selective OSP |
Application |
Cellular Phone, PCS, Hand Held Device, PDA |
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| 4. Memory Module |
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Specifications
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Layers |
4~12L |
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Base Material |
High-Tg,FR-4,Halogen Free,RoHS |
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Board Thickness |
16~50mil : 0.406~1.27mm |
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Min. Line Width |
3mil : 76 ㎛ |
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Min. Line Spacing |
3mil : 76 ㎛ |
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Min. Mech. Drill Size |
7.87mil : 200 ㎛ |
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Impedance Control |
+/-8% : +/-8% |
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Surface Treatment |
Gold Finger,Immersion Gold, OSP, HASL |
Application |
Desk Top, Note Book, Workstation |
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| 5. TFT LCD |
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Specifications |
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Layers |
2~8L |
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Base Material |
High-Tg,FR-4,Halogen Free,RoHS,Middle-Tg |
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Board Thickness |
7.87~63mil : 0.2~1.6mm |
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Min. Line Width |
3mil : 76 ㎛ |
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Min. Line Spacing |
3mil : 76 ㎛ |
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Min. Mech. Drill Size |
7.87mil : 200 ㎛ |
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Displayl Size |
~46inch : ~1,168 ㎛ |
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Surface Treatment |
Immersion Gold, OSP |
Application |
PC Monitor, Note Book Monitor, LCD TV, PDP |
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| 6. High Layer Board |
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Specifications |
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Layers |
12~32L |
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Base Material |
High-Tg,FR-4,Halogen Free,RoHS,RO4000,RCC |
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Board Thickness |
63~126mil : 1.6~3.2mm |
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Min. Line Width |
3mil : 76 ㎛ |
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Min. Line Spacing |
3mil : 76 ㎛ |
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Min. Mech. Drill Size |
7.87mil : 200 ㎛ |
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Min. Laser Drill Size |
3.94mil : 100 ㎛ |
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Surface Treatment |
Immersion Gold, OSP, HASL |
Application |
Network Systems, Servers, Routers, Super Computers |
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| Flexible PCB(FPCB) |
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| 1. Sigle Side FPCB |
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Specifications
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Layers
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1L |
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Base Material |
FCCL, Coverlay |
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Board Thickness
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0.06~0.08mm |
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Trace Width
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0.05mm |
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Line Spacing
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0.05mm |
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Application
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CD-ROM Pick Up, Camcoder, Connector |
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| 2. Double Side FPCB |
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Specifications
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Layers
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1~2L |
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Base Material
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FCCL, Coverlay |
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Board Thickness
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0.15~0.20mm |
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Trace Width
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0.06mm |
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Line Spacing
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0.06mm |
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Min. Mech. Hole Size
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0.12mm |
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Application
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Key Pad, Side Key, Ear Jack |
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| 3. Multi Layer FPCB |
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Specifications |
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Layers |
4~8L |
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Base Material |
FCCL,Coverlay,Bonding Sheet |
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Board Thickness |
0.40~0.80mm |
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Trace Width |
0.075mm |
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Line Spacing |
0.075mm |
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Min. Mech. Hole Size |
0.15mm |
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Application |
LCD Module, Mobile Phone, Digital Camera |
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| 4. Next Generation Display |
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Specifications
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Layers
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1~2L |
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Base Material
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FCCL,Coverlay |
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Board Thickness
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0.05~0.10mm |
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Trace Width
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0.04mm |
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Line Spacing
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0.04mm |
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Min. Mech. Hole Size
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0.12mm |
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Application
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TFT LCD, PDP |
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| 5. Rigid Flexible PCB |
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Specifications |
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Layers |
4~8L |
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Base Material |
FCCL,Coverlay,Low Regin,Prepreg |
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Board Thickness |
0.40~0.80mm |
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Trace Width |
0.075mm |
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Line Spacing |
0.075mm |
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Min. Mech. Hole Size |
0.15mm |
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Application |
Mobile Phone |
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